Deutsche Version
We manufacture highly-precise, structured glass wafers for the WLP of MEMS and MOEMS.
Different manufacturing processes offer an economical and industrially useful wafer level encapsulation solution with important benefits for the customer for a broad range of MEMS, RF-MEMS and MOEMS.
Applications: Various applications can be found where micro-electro-mechanical systems are used.
Encapsulation wafers with complex structures can be manufactured with a high level of precision at relatively low cost. Almost any structures and cavities can be formed or
shaped into the glass on customer's request.
Material: Glass wafers are manufactured of Borosilicate glass (Borofloat 33®, Pyrex® 7740).
Features:
- Thermal coefficient of expansion adapted to the Si-Wafer
- A great amount of freedom for designing the cavities, even non-uniform depths
- Full cross-sectrion control
- Transparent
- Microcrack and chip-free structure surface
- Tight form and position tolerances
- Perfect edges
- Transparent surfaces down to 40 nm RMS
- Very even and parallel surfaces, low levels of roughness
- Ready-to-bond
- Alignment marks
Integration of defined apertures or optical windows for use with MOEMS is possible. With these new encapsulation products BERLINER GLAS can support the manufacturing of complex sensor systems, from prototype up to series production.
